Global Chip On Flex (COF) Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

Scope of the Report:
This report focuses on the Chip On Flex (COF) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver.
Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers.
In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world’s third producer of COF and the world’s biggest consumption market.
The worldwide market for Chip On Flex (COF) is expected to grow at a CAGR of roughly 4.4% over the next five years, will reach 1850 million US$ in 2023, from 1490 million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Manufacturers, this report covers
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Single sided COF
Others

Market Segment by Applications, can be divided into
Military
Medical
Aerospace
Electronics
Other

There are 15 Chapters to deeply display the global Chip On Flex (COF) market.
Chapter 1, to describe Chip On Flex (COF) Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Chip On Flex (COF), with sales, revenue, and price of Chip On Flex (COF), in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Chip On Flex (COF), for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Chip On Flex (COF) market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Chip On Flex (COF) sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source