Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. This report studies the Semiconductor sputtering target material market.

The global Semiconductor Sputtering Targets market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Sputtering Targets volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Sputtering Targets market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
JX Nippon Mining & Metals Corporation
Praxair
Hitachi Metals
Honeywell
Sumitomo Chemical
ULVAC
Materion (Heraeus)
GRIKIN Advanced Material Co., Ltd.
TOSOH
Ningbo Jiangfeng
FURAYA Metals Co., Ltd
Advantec
Angstrom Sciences
Umicore Thin Film Products

Segment by Regions
North America
Europe
China
Japan
South Korea

Segment by Type
Titanium Target
Aluminum Target
Tantalum Target
Copper Target
Others

Segment by Application
Wafer Manufacturing
Packaging and Testing