Table of Contents PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: INTRODUCTION • Market outline PART 05: MARKET LANDSCAPE • Market ecosystem • Market characteristics • Market segmentation analysis PART 06: MARKET SIZING • Market definition • Market sizing 2017 • Market size and forecast 2017-2022 PART 07: FIVE FORCES ANALYSIS • Bargaining power of buyers • Bargaining power of suppliers • Threat of new entrants • Threat of substitutes • Threat of rivalry • Market condition PART 08: MARKET SEGMENTATION BY APPLICATION • Comparison by application • Smartphones – Market size and forecast 2017-2022 • SSD – Market size and forecast 2017-2022 • Memory cards – Market size and forecast 2017-2022 • Tablets – Market size and forecast 2017-2022 • Others – Market size and forecast 2017-2022 • Market opportunity by application PART 09: MARKET SEGMENTATION BY TECHNOLOGY • Segmentation by technology • Comparison by technology • TLC– Market size and forecast 2017-2022 • MLC – Market size and forecast 2017-2022 • SLC – Market size and forecast 2017-2022 • Market opportunity by application PART 10: MARKET SEGMENTATION BY TYPE • Segmentation by type • Comparison by type • 2D NAND – Market size and forecast 2017-2022 • 3D NAND – Market size and forecast 2017-2022 • Market opportunity by type PART 11: CUSTOMER LANDSCAPE PART 12: REGIONAL LANDSCAPE • Geographical segmentation • Regional comparison • APAC – Market size and forecast 2017-2022 • Americas – Market size and forecast 2017-2022 • EMEA – Market size and forecast 2017-2022 • Key leading countries • Market opportunity PART 13: DECISION FRAMEWORK PART 14: DRIVERS AND CHALLENGES • Market drivers • Market challenges PART 15: MARKET TRENDS • Growing popularity of 3D NAND • Growing popularity of IoT • Evolution of signal processing technology in NAND flash market • Fluctuation in price of NAND flash PART 16: VENDOR LANDSCAPE • Overview • Landscape disruption • Competitive scenario PART 17: VENDOR ANALYSIS • Vendors covered • Vendor classification • Market positioning of vendors • SAMSUNG • Toshiba • Western Digital • Micron Technology • SK Hynix • Intel PART 18: APPENDIX • List of abbreviations List of Exhibits Exhibit 01: Comparison of NOR and NAND flash memories Exhibit 02: Classification of semiconductor memory Exhibit 03: Parent market Exhibit 04: Global memory module market Exhibit 05: Market characteristics Exhibit 06: Market segments Exhibit 07: Market definition - Inclusions and exclusions checklist Exhibit 08: Market size 2017 Exhibit 09: Validation techniques employed for market sizing 2017 Exhibit 10: Global – Market size and forecast 2017-2022 ($ bn) Exhibit 11: Global – Year-over-year growth 2018-2022 (%) Exhibit 12: Five forces analysis 2017 Exhibit 13: Five forces analysis 2022 Exhibit 14: Bargaining power of buyers Exhibit 15: Bargaining power of suppliers Exhibit 16: Threat of new entrants Exhibit 17: Threat of substitutes Exhibit 18: Threat of rivalry Exhibit 19: Market condition - Five forces 2017 Exhibit 20: Application- Market share 2017-2022 (% share) Exhibit 21: Comparison by application Exhibit 22: Smartphones – Market size and forecast 2017-2022 ($ bn) Exhibit 23: Smartphones – Year-over-year growth 2018-2022 (%) Exhibit 24: SSD – Market size and forecast 2017-2022 ($ bn) Exhibit 25: SSD – Year-over-year growth 2018-2022 (%) Exhibit 26: Memory cards – Market size and forecast 2017-2022 ($ bn) Exhibit 27: Memory cards – Year-over-year growth 2018-2022 (%) Exhibit 28: Tablets – Market size and forecast 2017-2022 ($ bn) Exhibit 29: Tablets – Year-over-year growth 2018-2022 (%) Exhibit 30: Others – Market size and forecast 2017-2022 ($ bn) Exhibit 31: Others – Year-over-year growth 2018-2022 (%) Exhibit 32: Market opportunity by application Exhibit 33: Technology– Market share 2017-2022 (%) Exhibit 34: Comparison by technology Exhibit 35: TLC – Market size and forecast 2017-2022 ($ bn) Exhibit 36: TLC – Year-over-year growth 2018-2022 (%) Exhibit 37: MLC – Market size and forecast 2017-2022 ($ bn) Exhibit 38: MLC – Year-over-year growth 2018-2022 (%) Exhibit 39: SLC – Market size and forecast 2017-2022 ($ bn) Exhibit 40: SLC – Year-over-year growth 2018-2022 (%) Exhibit 41: Market opportunity by application Exhibit 42: Type – Market share 2017-2022 (%) Exhibit 43: Comparison by type Exhibit 44:D NAND – Market size and forecast 2017-2022 ($ bn) Exhibit 45:D NAND – Year-over-year growth 2018-2022 (%) Exhibit 46:D NAND – Market size and forecast 2017-2022 ($ bn) Exhibit 47:D NAND – Year-over-year growth 2018-2022 (%) Exhibit 48: Market opportunity by type Exhibit 49: Customer landscape Exhibit 50: Global – Market share by geography 2017-2022 (%) Exhibit 51: Regional comparison Exhibit 52: Americas – Market size and forecast 2017-2022 ($ bn) Exhibit 53: APAC – Year-over-year growth 2018-2022 (%) Exhibit 54: Americas – Market size and forecast 2017-2022 ($ bn) Exhibit 55: Americas – Year-over-year growth 2018-2022 (%) Exhibit 56: EMEA – Market size and forecast 2017-2022 ($ bn) Exhibit 57: EMEA – Year-over-year growth 2018-2022 (%) Exhibit 58: Key leading countries Exhibit 59: Market opportunity Exhibit 60: Global smartphones and tablets shipments (millions of units) Exhibit 61: Comparison of SSDs vs HDDs Exhibit 62: Vendor landscape Exhibit 63: Landscape disruption Exhibit 64: Vendors covered Exhibit 65: Vendor classification Exhibit 66: Market positioning of vendors Exhibit 67: Vendor overview Exhibit 68: SAMSUNG – Business segments Exhibit 69: SAMSUNG – Organizational developments Exhibit 70: SAMSUNG – Geographic focus Exhibit 71: SAMSUNG – Segment focus Exhibit 72: SAMSUNG – Key offerings Exhibit 73: Vendor overview Exhibit 74: Toshiba – Business segments Exhibit 75: Toshiba – Organizational developments Exhibit 76: Toshiba – Geographic focus Exhibit 77: Toshiba – Segment focus Exhibit 78: Toshiba – Key offerings Exhibit 79: Vendor overview Exhibit 80: Toshiba – Business segments Exhibit 81: SAMSUNG – Organizational developments Exhibit 82: Western Digital – Geographic focus Exhibit 83: Western Digital – Segment focus Exhibit 84: Western Digital– Key offerings Exhibit 85: Vendor overview Exhibit 86: Micron Technology – Business segments Exhibit 87: Micron Technology – Organizational developments Exhibit 88: Micron Technology – Geographic focus Exhibit 89: Western Digital – Segment focus Exhibit 90: Micron Technology– Key offerings Exhibit 91: Vendor overview Exhibit 92: SK Hynix – Business segments Exhibit 93: SK Hynix – Organizational developments Exhibit 94: SK Hynix – Geographic focus Exhibit 95: SK Hynix – Segment focus Exhibit 96: SK Hynix – Key offerings Exhibit 97: Vendor overview Exhibit 98: Intel – Business segments Exhibit 99: Intel – Organizational developments Exhibit 100: Intel – Geographic focus Exhibit 101: Intel – Segment focus Exhibit 102: Intel– Key offerings

SAMSUNG, Toshiba, Western Digital, Micron Technology, SK Hynix and Intel.