Table of Contents The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020 Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020 Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020 Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020 Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019 Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendor's Business Type, 1Q 2017 - 3Q 2019 Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019 Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019 Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019 Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019 Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019 Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2017 - 3Q 2019 Taiwanese DRAM Industry's 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019 Taiwanese DRAM Industry's 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019 Exchange Rate, 1Q 2017 - 3Q 2019 Research Scope & Definitions

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