Table of Contents 1.Worldwide Industry Shipment Value 1.1 Steady Growth in 2018 1.1.1 OSAT Companies’ Market Share Struck by Trade War 1.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018 1.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China 1.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing 1.2.2 Taiwanese IC packaging and testing industry Posts Higher-than-Global-Average Growth at 8.4% in 2018 2.Development of Leading International OSAT Companies 2.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics 2.2 JCET’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share 2.3 Tianshui Huatian Technology Did Not Live Up to Expectation in 201814 2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers 3. Development of Leading Taiwanese OSAT Companies 3.1 ASE Benefits from M&A Synergy with Focus on SiP Technology 3.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs 3.2 PTI Strives for Product Diversification by Expanding Non-Memory Business 3.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and Chipmos Revenues 4. MIC Perspective Appendix Glossary of Terms List of Companies List of Tables Table 1 M&A of Leading OSAT Companies over Past Five Years Table 2 ASE Revenues by Business Types Table 3 Milestones of ASE-SPIL Merger Table 4 PTI Revenue by Business Type List of Figures Figure 1 Worldwide IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019 Figure 2 World’s Top Ten OSAT Companies by Revenue in 2018 Figure 3 Taiwanese IC Packaging and Testing Industry Shipment Value and Growth Rates, 2016-2019

AMD Amkor ASE Asus Chipbond ChipMOS FCI Hisilicon Hynix J-Device JCET JSCK KYEC MediaTek Nanium NVidia Panasonic PTI Qorvo Qualcomm Samsung Sigurd SJSemi Skyworks SMIC SPIL STATS ChipPAC Tainshui Huatian Technology Tera Probe Tongu Microelectronics TSI Tsinghua Unigroup TSMC Unisem UTAC Winste