1 INTRODUCTION 1.1 Study Deliverables 1.2 Study Assumptions 1.3 Scope of the Study 2 RESEARCH METHODOLOGY 3 EXECUTIVE SUMMARY 4 MARKET DYNAMICS 4.1 Market Overview 4.2 Introduction to Market Drivers and Restraints 4.3 Market Drivers 4.3.1 Reduced Cost of Packaging Process 4.3.2 Enhanced Design Flexibility and Physical Performance of Chips 4.3.3 Increased Investment on Research & Development Activities 4.4 Market Restraints 4.4.1 Complexity in Packaging Process 4.5 Industry Value Chain Analysis 4.6 Industry Attractiveness - Porter's Five Force Analysis 4.6.1 Threat of New Entrants 4.6.2 Bargaining Power of Buyers/Consumers 4.6.3 Bargaining Power of Suppliers 4.6.4 Threat of Substitute Products 4.6.5 Intensity of Competitive Rivalry 5 MARKET SEGMENTATION 5.1 By Industry Application 5.1.1 Consumer Electronics 5.1.2 Automotive 5.1.3 Aerospace & Defence 5.1.4 Telecommunication 5.1.5 Other Industry Application 5.2 Geography 5.2.1 North America 5.2.2 Europe 5.2.3 Asia-Pacific 5.2.4 Rest of the World 6 COMPETITIVE LANDSCAPE 6.1 Company Profiles 6.1.1 Amkor Technology, Inc. 6.1.2 Deca Technologies 6.1.3 Lam Research Corporation 6.1.4 ASE Group 6.1.5 Siliconware Precision Industries Co., Ltd. 6.1.6 Fraunhofer Institute for Reliability and Microintegration IZM 6.1.7 Taiwan Semiconductor Manufacturing Company, Limited 6.1.8 Shinko Electric Industries Co, Ltd. 7 INVESTMENT ANALYSIS 8 MARKET OPPORTUNITIES AND FUTURE TRENDS