FOSB are specialized containers for transferring wafers from one manufacturing facility to another. The 25 wafer capacity, front opening shipping box (FOSB) is used to transport wafers from one wafer supplier to wafer fabs and between wafer fab facilities.

Market Analysis and Insights: Global and Japan Wafer Transport Boxes Market
This report focuses on global and Japan Wafer Transport Boxes market.
In 2020, the global Wafer Transport Boxes market size was US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027. In Japan the Wafer Transport Boxes market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Wafer Transport Boxes Scope and Market Size
Wafer Transport Boxes market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Transport Boxes market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For Japan market, this report focuses on the Wafer Transport Boxes market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in Japan.

Segment by Type
Polypropylene
Polycarbonate
Others

Segment by Application
Below 150mm
200mm
300mm
Others

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

By Company
Entegris
Brooks Automation
Shin-Etsu Polymer
Miraial Co.,Ltd.
Pozzetta
Gudeng Precision
ePAK
Wollemi Technical Inc.