Summary
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
The global Die Bonder Equipment market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):

Fully Automatic
Semi-Automatic
Manual
Demand Coverage (Market Size & Forecast, Consumer Distribution):
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Company Coverage (Sales data, Main Products & Services etc.):

Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

Major Region

Market
North America
Europe
Asia-Pacific
South America
Middle East & Africa