Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
At present, in the foreign industrial developed countries the Electronic Potting & Encapsulating industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the Europe and USA. Meanwhile, foreign companies have more mature equipment, strong R & D capability, and the technical level is also in a leading position. But in foreign companies the manufacturing cost is relatively high, compared with in China. So the manufacturing cost in developed countries is a disadvantage. As the production technology of Electronic Potting & Encapsulating manufacturers in China continues to improve, the share of Chinese manufactures will be increasing, and the competitiveness in the international market will also gradually increase.

Market Analysis and Insights: Global Electronic Potting & Encapsulating Market
The global Electronic Potting & Encapsulating market was valued at US$ 1827.8 in 2020 and will reach US$ 3455.9 million by the end of 2027, growing at a CAGR of 11.2% during 2022-2027.

Global Electronic Potting & Encapsulating Scope and Market Size
The global Electronic Potting & Encapsulating market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Electronic Potting & Encapsulating market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Silicones
Epoxy
Polyurethane
Others

Segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others

The Electronic Potting & Encapsulating market is analysed and market size information is provided by regions (countries). Segment by Application, the Electronic Potting & Encapsulating market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Henkel
DowDuPont
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions