Resin systems are intended to protect and insulate printed circuit boards and electronic components from the pressures of harsh and challenging environments, including; vibration moisture, physical shock and general contamination. By encapsulating the entire device, resins can procedure a complete barrier against such environments contribution superior performance under extreme circumstances. It is thermally conductive, shock absorbent, electrical insulating, and resistant to chemical & environmental exposure. In addition, this include low pressure molding, increase the advancements in development of sensors for research purposes, and medical sector has surged the demand for encapsulation resins.

Market Analysis and Insights: Global Encapsulation Resins Market
The global Encapsulation Resins market was valued at US$ 837.5 in 2020 and will reach US$ 1036.1 million by the end of 2027, growing at a CAGR of 3.6% during 2022-2027.

Global Encapsulation Resins Scope and Market Size
The global Encapsulation Resins market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Encapsulation Resins market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Epoxy Resins
Silicone Resins
Polyurethane Resins
Other

Segment by Application
Electronics & Electricals Components
Telecommunication Components
Automotive Components
Other

The Encapsulation Resins market is analysed and market size information is provided by regions (countries). Segment by Application, the Encapsulation Resins market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Henkel AG
KGaA
Hitachi Chemical
Huntsman International
H.B. Fuller Company
ACC Silicones
BASF SE
DowDuPont
Fuji Chemical Industries
Shin-Etsu Chemical