The global market for Fully Automatic Semiconductor Molding Equipment is estimated to increase from US$ million in 2021 to reach US$ million by 2028, exhibiting a CAGR of % during 2022-2028. Keeping in mind the uncertainties of COVID-19 and Russia-Ukraine War, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.

The APAC Fully Automatic Semiconductor Molding Equipment market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.

The United States Fully Automatic Semiconductor Molding Equipment market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.

The Europe Fully Automatic Semiconductor Molding Equipment market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.

The China Fully Automatic Semiconductor Molding Equipment market is expected at value of US$ million in 2022 and grow at approximately % CAGR during 2022 and 2028.

Global key Fully Automatic Semiconductor Molding Equipment players cover TOWA, ASMPT, Besi, I-PEX and Yamada, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.

Report Coverage

This latest report provides a deep insight into the global Fully Automatic Semiconductor Molding Equipment market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, value chain analysis, etc.

This report aims to provide a comprehensive picture of the global Fully Automatic Semiconductor Molding Equipment market, with both quantitative and qualitative data, to help readers understand how the Fully Automatic Semiconductor Molding Equipment market scenario changed across the globe during the pandemic and Russia-Ukraine War.

The base year considered for analyses is 2021, while the market estimates and forecasts are given from 2022 to 2028. The market estimates are provided in terms of revenue in USD millions and volume in K Units.

Market Segmentation:

The study segments the Fully Automatic Semiconductor Molding Equipment market and forecasts the market size by Type (Hydraulic Semiconductor Molding System and Electric Semiconductor Molding System,), by Application (Wafer Level Packaging, BGA Packaging, Flat Panel Packaging and Others), and region (APAC, Americas, Europe, and Middle East & Africa).

Segmentation by type

Hydraulic Semiconductor Molding System

Electric Semiconductor Molding System

Segmentation by application

Wafer Level Packaging

BGA Packaging

Flat Panel Packaging

Others

Segmentation by region

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

Major companies covered

TOWA

ASMPT

Besi

I-PEX

Yamada

TAKARA TOOL & DIE

Asahi Engineering

Tongling Fushi Sanjia

Nextool Technology

DAHUA Technology

Chapter Introduction

Chapter 1: Scope of Fully Automatic Semiconductor Molding Equipment, Research Methodology, etc.

Chapter 2: Executive Summary, global Fully Automatic Semiconductor Molding Equipment market size (sales and revenue) and CAGR, Fully Automatic Semiconductor Molding Equipment market size by region, by type, by application, historical data from 2017 to 2022, and forecast to 2028.

Chapter 3: Fully Automatic Semiconductor Molding Equipment sales, revenue, average price, global market share, and industry ranking by company, 2017-2022

Chapter 4: Global Fully Automatic Semiconductor Molding Equipment sales and revenue by region and by country. Country specific data and market value analysis for the U.S., Canada, Europe, China, Japan, South Korea, Southeast Asia, India, Latin America and Middle East & Africa.

Chapter 5, 6, 7, 8: Americas, APAC, Europe, Middle East & Africa, sales segment by country, by type, and type.

Chapter 9: Analysis of the current market trends, market forecast, opportunities and economic trends that are affecting the future marketplace

Chapter 10: Manufacturing cost structure analysis

Chapter 11: Sales channel, distributors, and customers

Chapter 12: Global Fully Automatic Semiconductor Molding Equipment market size forecast by region, by country, by type, and application.

Chapter 13: Comprehensive company profiles of the leading players, including TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology and etc.

Chapter 14: Research Findings and Conclusion