In semiconductor manufacturing plasma ashing is the process of removing the photoresist (light sensitive coating) from an etched wafer. Using a plasma source, a monatomic (single atom) substance known as a reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ash which is removed with a vacuum pump.
Two forms of plasma ashing are typically performed on wafers. High temperature ashing, or stripping, is performed to remove as much photo resist as possible, while the ""descum"" process is used to remove residual photo resist in trenches. The main difference between the two processes is the temperature the wafer is exposed to while in an ashing chamber.

Market Analysis and Insights: Global Photoresist Ashing Equipment Market
In 2020, the global Photoresist Ashing Equipment market size was US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% between 2021 and 2027
Global Photoresist Ashing Equipment Scope and Market Size
The global Photoresist Ashing Equipment market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Photoresist Ashing Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), byType, and by Application for the period 2016-2027.

Segment by Type
Desktop
Floor-standing

Segment by Application
IC
Advanced Packaging
MEMS
LED

By Company
PVA TePla
PIE Scientific
SAMCO INC.
ESI
Diener electronic GmbH
ULVAC
Trion Technology
YAC HOLDINGS CO

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Colombia
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE