According to this latest study, the 2021 growth of Quad-Flat-No-Lead Packaging (QFN) will have significant change from previous year. By the most conservative estimates of global Quad-Flat-No-Lead Packaging (QFN) market size (most likely outcome) will be a year-over-year revenue growth rate of % in 2021, from US$ 2701 million in 2020. Over the next five years the Quad-Flat-No-Lead Packaging (QFN) market will register a 1.6% CAGR in terms of revenue, the global market size will reach US$ 2873.1 million by 2026.

This report presents a comprehensive overview, market shares, and growth opportunities of Quad-Flat-No-Lead Packaging (QFN) market by product type, application, key manufacturers and key regions and countries.

Segmentation by type: breakdown data from 2016 to 2021, in Section 2.3; and forecast to 2026 in section 11.7.
Punched Type
Sawn Type

Segmentation by application: breakdown data from 2016 to 2021, in Section 2.4; and forecast to 2026 in section 11.8.
Below 2x2
2x2 to 3x3
Above 3x3 to 5x5
Above 5x5 to 7x7
Above 7x7 to 9x9
Above 9x9 to 12x12

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in Chapter 3.
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
ChipMOS
King Yuan Electronics
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