Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components.
Geographically, North America is the largest market for radiation hardened electronics market. Europe is the second largest global market followed by Asia-Pacific.

The global Radiation-Hardened Electronic Components market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Radiation-Hardened Electronic Components volume and value at global level, regional level and company level. From a global perspective, this report represents overall Radiation-Hardened Electronic Components market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Radiation-Hardened Electronic Components in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Radiation-Hardened Electronic Components manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Honeywell International
BAE Systems
Analog Devices
Texas Instruments
Atmel
Renesas Electronics
STMicroelectronics
Microsemi
Xilinx
Cobham
VPT
Data Device Corporation (DDC)
Intersil
Maxwell Technologies

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Silicon
Silicon Carbide
Gallium Nitride
Others

Segment by Application
Aerospace and Defense
Medical
Consumer Electronics
Industrial
Others