Global Advanced Packaging Inspection Systems Market Insights and Forecast to 2028

Advanced Packaging Inspection Systems is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control through multi-mode optics and sensors and advanced defect detection algorithms.
Market Analysis and Insights: Global Advanced Packaging Inspection Systems Market
Due to the COVID-19 pandemic, the global Advanced Packaging Inspection Systems market size is estimated to be worth US$ 474.8 million in 2022 and is forecast to a readjusted size of US$ 685 million by 2028 with a CAGR of 6.3% during the review period. Fully considering the economic change by this health crisis, Optical Based Packaging Inspection Systems accounting for % of the Advanced Packaging Inspection Systems global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Consumer Electronics segment is altered to an % CAGR throughout this forecast period.
The Advanced Packaging Inspection Systems market is quite concentrated, with the top five vendors KLA-Tencor, Onto Innovation, Semiconductor Technologies & Instruments (STI), Cohu and Camtek dominate approximately 90% of the industry total revenue. Korea, Taiwan, Japan, China and Southeast Asia is the main countries which are dominated in the semiconductor manufacturing industry. Europe and USA is also trying to recover their semiconductor industry. However, developing countries such as China has higher growth rate and more opportunities because of the government support and the demand growth in these countries.
In terms of production side, this report researches the Advanced Packaging Inspection Systems capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Advanced Packaging Inspection Systems by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Advanced Packaging Inspection Systems Scope and Segment
Advanced Packaging Inspection Systems market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Advanced Packaging Inspection Systems market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Optical Based Packaging Inspection Systems
Infrared Packaging Inspection Systems
Segment by Application
Consumer Electronics
Automotive Electronics
Industrial
Healthcare
Others
By Company
KLA-Tencor
Onto Innovation
Semiconductor Technologies & Instruments (STI)
Cohu
Camtek
Production by Region
US
Israel
Singapore
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE