Global and United States Wafer Bonding Machines Market Report & Forecast 2022-2028

Wafer bonding machine is a device specifically used for the wafer bonding process, which refers to the close bonding of two mirror-polished homogeneous or heterogeneous wafers through chemical and physical effects. Atoms are reacted by external forces to form covalent bonds to form a whole, and make the bonding interface reach a specific bonding strength. It can greatly reduce the volume of electronic components and is widely used in the production of MEMS, CMOS image sensors and other components.
Market Analysis and Insights: Global and United States Wafer Bonding Machines Market
This report focuses on global and United States Wafer Bonding Machines market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global Wafer Bonding Machines market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, by Type, Wafer Size: 200mm accounting for % of the Wafer Bonding Machines global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Application, MEMS was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
In United States the Wafer Bonding Machines market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period.
Global Wafer Bonding Machines Scope and Market Size
Wafer Bonding Machines market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Wafer Bonding Machines market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the Wafer Bonding Machines market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
Wafer Size: 200mm
Wafer Size: 300mm
Segment by Application
MEMS
Power Device
LED
RF Components
CMOS Sensor
Solar Panel
Advanced Packaging
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
By Company
EV Group
SUSS MicroTec
Dynatex International
AML
Mitsubishi Heavy Industries
Ayumi Industries Company Limited
Tokyo Electron Limited
SMEE
U-Precision