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Global Bonding Wire Packaging Material Market Professional Survey Report 2019
SKU ID : QYR-14708389 | Publishing Date : 16-Sep-2019 | No. of pages : 113
Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades.
One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer’s requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.
An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period.
The global market for Bonding Wire Packaging Material was dominated by APAC and it accounted for a significant share of the total market. This dominance of APAC is the likely result of the presence of several semiconductor manufacturing giants in this part of the world. Moreover, factors such as the use of alternative materials for packaging and technological advancements will play a crucial role in the growth of this region during the forecasted period.
The global Bonding Wire Packaging Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Bonding Wire Packaging Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Bonding Wire Packaging Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Bonding Wire Packaging Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Bonding Wire Packaging Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Alpha Packaging
APEX Plastics
Amcor
TANAKA Precious Metals
Heraeus Deutschland
California Fine Wire
MK Electron
AMETEK
EMMTECH
Inseto
Palomar Technologies
Sumitomo Metal Mining
Tatsuta Electric Wire & Cable
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Gold
Palladium-Coated Copper (PCC)
Copper
Silver
Segment by Application
Packaging
Others
One of the primary growth drivers for this market is the increased need for miniaturization, especially in the semiconductor industry. Bonding wires are an important part of assemblies, and metals like copper, aluminum, gold, and palladium are extensively used to produce bonding wires. In this market, the vendors need to constantly upgrade their offerings with more advanced and compact packaging materials as it will help them to cater to the consumer’s requirements. The demand for bonding wires has increased significantly owing to the growing need for miniaturization to meet the packaging requirements of the semiconductor industry.
An important trend that is spurring market growth is the extensive use of silver as an alternative material. Since the semiconductor industry is under constant pressure to introduce low-cost alternatives to gold without compromising on the quality, the use of silver as a bonding wire has been gaining traction during the forecast period.
The global market for Bonding Wire Packaging Material was dominated by APAC and it accounted for a significant share of the total market. This dominance of APAC is the likely result of the presence of several semiconductor manufacturing giants in this part of the world. Moreover, factors such as the use of alternative materials for packaging and technological advancements will play a crucial role in the growth of this region during the forecasted period.
The global Bonding Wire Packaging Material market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Bonding Wire Packaging Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Bonding Wire Packaging Material market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Bonding Wire Packaging Material in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Bonding Wire Packaging Material manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Alpha Packaging
APEX Plastics
Amcor
TANAKA Precious Metals
Heraeus Deutschland
California Fine Wire
MK Electron
AMETEK
EMMTECH
Inseto
Palomar Technologies
Sumitomo Metal Mining
Tatsuta Electric Wire & Cable
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Gold
Palladium-Coated Copper (PCC)
Copper
Silver
Segment by Application
Packaging
Others
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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