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Global Die Attach Materials Market Growth 2019-2024
SKU ID : LPI-13842277 | Publishing Date : 07-Feb-2019 | No. of pages : 162
Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.
For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results.
In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share.
At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016.
In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and others. Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global.
In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.
According to this study, over the next five years the Die Attach Materials market will register a 5.6% CAGR in terms of revenue, the global market size will reach US$ 1070 million by 2024, from US$ 770 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Die Attach Materials business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Materials market by product type, application, key manufacturers and key regions and countries.
This study considers the Die Attach Materials value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Die Attach Paste
Die Attach Wire
Others
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Consumer Electronics
Automotive
Medical
Telecommunications
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Die Attach Materials consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Die Attach Materials market by identifying its various subsegments.
Focuses on the key global Die Attach Materials manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Die Attach Materials with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Die Attach Materials submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results.
In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share.
At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016.
In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and others. Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global.
In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.
According to this study, over the next five years the Die Attach Materials market will register a 5.6% CAGR in terms of revenue, the global market size will reach US$ 1070 million by 2024, from US$ 770 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Die Attach Materials business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Die Attach Materials market by product type, application, key manufacturers and key regions and countries.
This study considers the Die Attach Materials value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Die Attach Paste
Die Attach Wire
Others
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Consumer Electronics
Automotive
Medical
Telecommunications
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Die Attach Materials consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Die Attach Materials market by identifying its various subsegments.
Focuses on the key global Die Attach Materials manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Die Attach Materials with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Die Attach Materials submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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