Global Die Attach Solder Pastes Sales Market Report 2021

Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint. Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.

Market Analysis and Insights: Global Die Attach Solder Pastes Market
The global Die Attach Solder Pastes market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

Global Die Attach Solder Pastes Scope and Market Size
The global Die Attach Solder Pastes market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Die Attach Solder Pastes market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
No-Clean Solder Pastes
Rosin Based Solder Pastes
Water Soluble Solder Pastes
Others

Segment by Application
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others

The Die Attach Solder Pastes market is analysed and market size information is provided by regions (countries). Segment by Application, the Die Attach Solder Pastes market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
SMIC
Alpha Assembly Solutions
Indium Corporation
Heraeu
Shenmao Technology
Henkel
Shenzhen Weite New Material
TONGFANG TECH
Sumitomo Bakelite
AIM
Tamura
Asahi Solder
Kyocera
Shanghai Jinji
NAMICS
Hitachi Chemical
Nordson EFD
Dow
Inkron
Palomar Technologies