Global Flip Chip Bonder Market Growth 2019-2024

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside-precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 28.64%, in terms of revenue. China market is expected to be the biggest market with sales market share of 25.67% in 2022.
Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.
Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market.

According to this study, over the next five years the Flip Chip Bonder market will register a 13.1% CAGR in terms of revenue, the global market size will reach US$ 510 million by 2024, from US$ 250 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Flip Chip Bonder business, shared in Chapter 3.

This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Bonder market by product type, application, key manufacturers and key regions and countries.

This study considers the Flip Chip Bonder value and volume generated from the sales of the following segments:

Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
Automatic Flip Chip Bonder
Semi-Automatic Flip Chip Bonder
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
IDMs
OSAT

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Besi
ASM Pacific Technology
Shibaura
Muehlbauer
Kulicke & Soffa
Hamni
AMICRA Microtechnologies
SET

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
To study and analyze the global Flip Chip Bonder consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Flip Chip Bonder market by identifying its various subsegments.
Focuses on the key global Flip Chip Bonder manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Flip Chip Bonder with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Flip Chip Bonder submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.