Global Molded Interconnect Devices (MID) Market Insights and Forecast to 2027

The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.

Market Analysis and Insights: Global Molded Interconnect Devices (MID) Market
The global Molded Interconnect Devices (MID) market is valued at US$ XX million in 2019. The market size will reach US$ XX million by the end of 2026, growing at a CAGR of XX% during 2021-2026.

Global Molded Interconnect Devices (MID) Scope and Segment
Molded Interconnect Devices (MID) market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Molded Interconnect Devices (MID) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.

Segment by Type
Laser Direct Structuring (LDS)
Two-Shot Molding
Others

Segment by Application
Automotive
Consumer Products
Healthcare
Industrial
Military & Aerospace
Telecommunication & Computing

By Company
MacDermid Enthone
Molex
LPKF Laser & Electronics
TE Connectivity
Harting Mitronics AG
SelectConnect Technologies
RTP company

Production by Region
North America
Europe
China
Japan

Consumption by Region
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Brazil
Middle East & Africa
Turkey
GCC Countries
Egypt
South Africa