Global Outsourced Semiconductor Assembly and Test (OSAT) Market Size, Status and Forecast 2019-2025

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.
Increased demand for outsourced SATS or OSAT services will be a remarkable trend favoring the growth of the global SATS market. With the rapidly thriving consumer electronics industry, the demand for connectivity and mobility is also on the rise, which is foreseen to be an important booster to the demand for connected devices, eventually fostering the semiconductor assembly and testing services market.
United States has the largest global export quantity and manufacturers in OSAT market, while the Taiwan is the second sales market for OSAT in 2017.
In the industry, ASE Group profits most in 2017 and recent years, while Amkor and JECT ranked 2 and 3.The market share of them is 18.81%, 15.13% and 13.02% in 2017.The gap of market share is keep on enlarged due to different strategy.
In 2018, the global Outsourced Semiconductor Assembly and Test (OSAT) market size was 29300 million US$ and it is expected to reach 39800 million US$ by the end of 2025, with a CAGR of 4.5% during 2019-2025.

This report focuses on the global Outsourced Semiconductor Assembly and Test (OSAT) status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Outsourced Semiconductor Assembly and Test (OSAT) development in United States, Europe and China.

The key players covered in this study
ASE Group
Amkor
JECT
SPIL
Powertech Technology Inc
TSHT
TFME
UTAC
Chipbond
ChipMOS
KYEC
Unisem
Walton Advanced Engineering
Signetics
Hana Micron

Market segment by Type, the product can be split into
Test Service
Assembly Service

Market segment by Application, split into
Communication
Computing & networking
Consumer electronics
Others

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Outsourced Semiconductor Assembly and Test (OSAT) status, future forecast, growth opportunity, key market and key players.
To present the Outsourced Semiconductor Assembly and Test (OSAT) development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of Outsourced Semiconductor Assembly and Test (OSAT) are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.