Global Plating for Microelectronics Sales Market Report 2021

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The market is majorly driven by the increasing demand from the microelectronics industry verticals. In this modern era, the disruptiveness of technology innovations in the consumer electronics sector is fast paced and the innovations are becoming easily accessible and affordable. The growing consumer needs, emergence of many new start-ups, IP infringement issues, and strong competition are forcing manufacturers to innovate and continuously asses growth opportunities.

Market Analysis and Insights: Global Plating for Microelectronics Market
The global Plating for Microelectronics market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

Global Plating for Microelectronics Scope and Market Size
The global Plating for Microelectronics market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Plating for Microelectronics market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others

Segment by Application
MEMS
PCB
IC
Photoelectron
Others

The Plating for Microelectronics market is analysed and market size information is provided by regions (countries). Segment by Application, the Plating for Microelectronics market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
DowDuPont
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International