Global Semiconductor Equipment Packaging and Test Market Professional Survey Report 2019

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

The global Semiconductor Equipment Packaging and Test market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Equipment Packaging and Test volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Equipment Packaging and Test market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Semiconductor Equipment Packaging and Test in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Semiconductor Equipment Packaging and Test manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
STATS ChipPAC
UTAC
ChipMos
Greatek
Huahong
JCET
KYEC
Lingsen Precision
Nepes
SMIC
Tianshui Huatian

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Semiconductor Equipment Packaging
Semiconductor Equipment Test

Segment by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)