Global System In Package Market Research Report 2021 - Impact of COVID-19 on the Market

SiP is a kind of package concept, which is a package method in which all or most of the electronic functions of a system or subsystem are arranged in an integrated substrate, and the chip is bonded to the integrated substrate in a 2D or 3D manner. The SIP package does not have a certain type. In terms of the arrangement of the chips, the SIP can be a planar 2D package of a multi-chip module, and the structure of the 3D package can be reused to effectively reduce the package area; and the internal bonding technology can be For simple wire bonding, flip chip bonding can also be used, but it can also be used in combination. In addition to the 2D and 3D package structure, another way to integrate components with versatile substrates can also be included in the scope of SIP. This technology is mainly to embed different components in the multi-function substrate, and can also be regarded as the concept of SIP to achieve the purpose of functional integration. Different chip arrangements, combined with different internal bonding technologies, enable a variety of combinations of SIP package types, and can be customized or flexibly produced according to customer or product requirements.
The System In Package market revenue was xx Million USD in 2016, grew to xx Million USD in 2021, and will reach xx Million USD in 2026, with a CAGR of xx during 2021-2026.

Considering the influence of COVID-19 on the global System In Package market, this report analyzed the impact from both global and regional perspectives. From production end to consumption end in regions such as North America, Europe, China, and Japan, the report put emphasis on analysis of market under COVID-19 and corresponding response policy in different regions.

This report also analyzes the strategies for different companies to deal with the impact of COVID-19 in detail to seek a path to recovery.

Under COVID-19 Outbreak, how the System In Package Industry will develop is also analyzed in detail in Chapter 1.8 of this report.

Major Players in System In Package market are:
Renesas Electronics
Texas Instruments
ASE
Signetics
KYEC
Samsung
Toshiba
Fujitsu
Chipmos Technologies
Jiangsu Changjiang Electronics
Amkor
Intel

Most important types of System In Package products covered in this report are:
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging

Most widely used downstream fields of System In Package market covered in this report are:
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace & Defense
Others

Major Region

s or countries covered in this report:
North America
Europe
China
Japan
Middle East and Africa
South America
India
South Korea
Southeast Asia
Others

In Chapter 3.4, the report provides analysis of the reasons behind price fluctuations.

In chapters 5, 6, and 7, the impact of COVID-19 on the different regions in both production and consumption end and SWOT analysis are pointed out.

In Chapters 8, the report presents company's recent development and strategies to deal with the impact of COVID-19.

Years considered for this report:

Historical Years:

2016-2020

Base Year:

2020

Estimated Year:

2021

Forecast Period:

2021-2026