Global Through Glass Vias Substrate Market Size, Status and Forecast 2020-2026

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS).
Asia-Pacific Through Glass Vias Substrate market size was valued at 18480 units in 2018, followed by Europe and North America.
The global market share concentration is relatively concentrated. Of the major players of the Through Glass Vias Substrate market, Corning maintained its first place in the ranking in 2018. Corning accounted for 26.90% of the Global Through Glass Vias Substrate revenue market share in 2018. Other players accounted for 21.49%, 11.93% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.

Worldwide, Consumer Electronics was the largest consumer of Through Glass Vias Substrate, which is responsible for about 57.37 percent of Through Glass Vias Substrate consumption in 2018. The remaining 42.63 percent was consumed for Biotechnology/Medical, Automotive etc.
Market Analysis and Insights: Global Through Glass Vias Substrate Market
In 2019, the global Through Glass Vias Substrate market size was US$ 31 million and it is expected to reach US$ 281.4 million by the end of 2026, with a CAGR of 36.7% during 2021-2026.
Global Through Glass Vias Substrate Scope and Market Size
Through Glass Vias Substrate market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Through Glass Vias Substrate market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Segment by Type, the Through Glass Vias Substrate market is segmented into 300 mm Wafer, 200 mm Wafer, Below 150 mm Wafer, etc.
Segment by Application, the Through Glass Vias Substrate market is segmented into Biotechnology/Medical, Consumer Electronics, Automotive, Others, etc.
Regional and Country-level Analysis
The Through Glass Vias Substrate market is analysed and market size information is provided by regions (countries).
The key regions covered in the Through Glass Vias Substrate market report are North America, Europe and Japan, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of revenue for the period 2015-2026.

Competitive Landscape

and Through Glass Vias Substrate Market Share Analysis
Through Glass Vias Substrate market competitive landscape provides details and data information by vendors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by player for the period 2015-2020. Details included are company description, major business, company total revenue and the revenue generated in Through Glass Vias Substrate business, the date to enter into the Through Glass Vias Substrate market, Through Glass Vias Substrate product introduction, recent developments, etc.
The major vendors include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, etc.

This report focuses on the global Through Glass Vias Substrate status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Through Glass Vias Substrate development in North America, Europe and Japan.

The key players covered in this study

Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

Market segment by Type, the product can be split into

300 mm Wafer
200 mm Wafer
Below 150 mm Wafer
In 2018, 300 mm Wafer accounted for a major share of 62% in the global Through Glass Vias Substrate market. And this product segment is poised to reach 130.49 Million US$ by 2025 from 13.65 Million US$ in 2018.

Market segment by Application, split into

Biotechnology/Medical
Consumer Electronics
Automotive
Others

Market segment by Regions/Countries, this report covers

North America
Europe
Japan

The study objectives of this report are:

To analyze global Through Glass Vias Substrate status, future forecast, growth opportunity, key market and key players.
To present the Through Glass Vias Substrate development in North America, Europe and Japan.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by type, market and key regions.

In this study, the years considered to estimate the market size of Through Glass Vias Substrate are as follows:
History Year: 2015-2019

Base Year:

2019

Estimated Year:

2020
Forecast Year 2020 to 2026
For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.