Global Wafer Level Packaging Market Report, History and Forecast 2016-2027, Breakdown Data by Manufacturers, Key Regions, Types and Application

Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.

There is no single industry-standard method of wafer-level packaging at present.

A major application area of WLPs are smartphones due to the size constraints.

Market Analysis and Insights: Global Wafer Level Packaging Market
In 2020, the global Wafer Level Packaging market size was US$ 3610 million and it is expected to reach US$ 7672.4 million by the end of 2027, with a CAGR of 10.9% between 2021 and 2027
Global Wafer Level Packaging Scope and Market Size
The global Wafer Level Packaging market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Level Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2016-2027.

Segment by Type
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)

Segment by Application
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)

By Company
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Colombia
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE