Global Wire Bonder Equipment Market Professional Survey Report 2019

Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.

The global Wire Bonder Equipment market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Wire Bonder Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wire Bonder Equipment market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Wire Bonder Equipment in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Wire Bonder Equipment manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
Ball Bonders
Stud-Bump Bonders
Wedge Bonders

Segment by Application
Steel
Manufacture
Others